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Mitigating electromigration of power supply networks using bidirectional current stress. Double patterning lithography friendly detailed routing with redundant via consideration. In this case, it included: workmanship, PCB design for reliabilty and manufacturability, strength analysis, life cycling on connectors, switches and electromechanical components, detailed black-box functional and software analysis, key component review, and other areas. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. In the last five decades, the number of transistors on a chip has increased exponentially in accordance with the Moore’s law, and the semiconductor industry has followed this law as long-term planning and targeting for research and development. Reliability aware gate sizing combating NBTI and oxide breakdown. Achieving high-yielding designs, in the state of the art VLSI technology has become an extremely challenging task due to the miniaturization as well as the complexity of leading-edge products. 9–13, Yang J-S, Lu K, Cho M, et al. 357: 6, Fang S-Y, Liu I-J, Chang Y-W. Stitch-aware routing for multiple e-beam lithography. Every production technology has its own specific design guideline that needs to be consulted depending on the situation. Soft-error-tolerant design methodology for balancing performance, power, and reliability. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2007. Proc SPIE, 2010: 7823, Elayat A, Lin T, Sahouria E, et al. Tax calculation will be finalised during checkout. Design for manufacturability (DFM) is an engineering practice that focuses on both the design aspect of a part, as well as its ability to be reliably manufactured. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Anaheim, 2010. 601–607, Chou H-M, Hsiao M-Y, Chen Y-C, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. 32–39, Zhang H B, Du Y L, Wong M D F, et al. Learn more about Institutional subscriptions, Moore G E. Lithography and the future of Moore’s law. 389–391, Ebrahimi M, Oboril F, Kiamehr S, et al. Double patterning layout decomposition for simultaneous conflict and stitch minimization. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. 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The most accepted lead-free alternatives present, for example, higher melting temperatures compared with the typically used Sn–Pb eutectic solder, which can affect both the manufacturability and reliability of lead-free electronics. Here, the DFM methodology includes a set of techniques to modify the design of integrated circuits (IC) in order to make them more manufacturable, i.e., to improve their functional yield, parametric yield, or their reliability. And the design specifications directly affect the manufacturability of the board. 201: 6, Peng H-K, Wen C H-P, Bhadra J. DfM can reduce many reliability costs, since products can be quickly assembled from fewer parts. In: Proceedings of IEEE/IFIP International Conference on Dependable Systems and Networks (DSN), Boston, 2012. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. 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Pan1, Sung Kyu Lim 2, Krit Athikulwongse , Moongon Jung , Joydeep Mitra 1, Jiwoo Pak , Mohit Pathak2, and Jae-seok Yang1 1 Department of ECE, University of Texas at Austin, Austin, TX, USA 2 School of ECE, Georgia Institute of Technology, Atlanta, GA, USA dpan@ece.utexas.edu, limsk@gatech.edu An efficient layout decomposition approach for triple patterning lithography. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. Title: Nanometer VLSI Physical Design for Manufacturability and Reliability 1 Nanometer VLSI Physical Design for Manufacturability and Reliability Ph.D. Proposal May 3rd, 2007. In: Proceedings of Symposium on VLSI Technology (VLSIT), Kyoto, 2013. IEEE Trans Comput Aided Des Integr Circ Syst, 2012, 31: 167–179, Edelsbrunner A, O’Rourke J, Welzl E. Stationing guards in rectilinear art galleries. $ Observe quality and reliability design guidelines; 29 guidelines are presented in Chapter 10, A Design for Quality,@ in the book Design for Manufacturability & … In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. New insights into the design for end-of-life variability of NBTI in scaled high-κ/metal-gate technology for the nano-reliability era. ABSTRACT. In addition, predictable development time, efficient manufacturing with high yields, and exemplary Aging-aware logic synthesis. Springer, 2015, Reis R, Cao Y, Wirth G. Circuit Design for Reliability. PubMed Google Scholar. A new lithography hotspot detection framework based on AdaBoost classifier and simplified feature extraction. Design for manufacturability and reliability in extreme-scaling VLSI. DOPPLER: DPL-aware and OPC-friendly gridless detailed routing with mask density balancing. 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Electron beam direct write lithography flexibility for ASIC manufacturing an opportunity for cost reduction. Methodology for standard cell compliance and detailed placement for triple patterning lithography. In: Proceedings of IEEE International Conference on Computer Design (ICCD), Seoul, 2014. Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Stateline, 2013. Proc SPIE, 2012: 8326, Kang W L, Feng C, Chen Y. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. 398–403, Lin Y-H, Ban Y-C, Pan D Z, et al. Yu, B., Xu, X., Roy, S. et al. 1–6, Realov S, Shepard K L. 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Engineers often talk about the importance of design for reliability (DfR) and the impact it has on a product’s overall efficiencies and success. Deep understanding of AC RTN in MuGFETs through new characterization method and impacts on logic circuits. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. On refining row-based detailed placement for triple patterning lithography. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2009. volume 59, Article number: 061406 (2016) IEEE Trans Comput Aided Des Integr Circ Syst, 2013, 32: 419–432, Hougardy S, Nieberg T, Schneider J. BonnCell: automatic layout of leaf cells. A polynomial time exact algorithm for self-aligned double patterning layout decomposition. 396–403, Yu B, Xu X Q, Gao J-R, et al. J Micro/Nanolithogr MEMS MOEMS, 2015, 14: 011003, Matsunawa T, Gao J-R, Yu B, et al. Sci. 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Keep the design simple is difficult, and the payoff is fewer parts, fewer tools, less complexity, and organization needed to conduct maintenance (which screw goes where? In: Proceedings of IEEE International Reliability Physics Symposium (IRPS), Waikoloa, 2014. US Patent 8-495-548, Gao J-R, Yu B, Huang R, et al. 1047–1052, Wu K-C, Marculescu D. Joint logic restructuring and pin reordering against NBTI-induced performance degradation. Dissertation for the Doctoral Degree. Triple patterning aware detailed placement with constrained pattern assignment. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. IEEE Trans Electron Dev, 2015, 62: 1725–1732, Ren P P, Xu X Q, Hao P, et al. Understanding soft errors in uncore components. The purpose of this course is to augment the mechanical design process with a body of knowledge concerning the manufacturing aspects as related to design. Introduction Product quality and reliability are essential in the medical device industry. Impacts of random telegraph noise (RTN) on digital circuits. By incorporating manufacturability concepts into the design process it is feasible to avoid downstream problems in the manufacturing arena. It’s not enough to design a part that looks cool or functions in a novel way. Proc SPIE, 2015: 9427, Mirsaeedi M, Torres J A, Anis M. Self-aligned double-patterning (SADP) friendly detailed routing. Timing yield-aware color reassignment and detailed placement perturbation for bimodal cd distribution in double patterning lithography. An effective triple patterning aware grid-based detailed routing approach. 637–644, Yu B, Yuan K, Ding D, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2009. T186–T187, Luo M, Wang R Q, Guo S N, et al. Fast yield-driven fracture for variable shaped-beam mask writing. Metal-density-driven placement for CMP variation and routability. Directed self-assembly based cut mask optimization for unidirectional design. Assessment and comparison of different approaches for mask write time reduction. Science, 2008, 321: 939–943, Luo M, Epps T H. Directed block copolymer thin film self-assembly: emerging trends in nanopattern fabrication. Proc SPIE, 2015: 9427, Chava B, Rio D, Sherazi Y, et al. Proc SPIE, 2004, 5567, Kahng A B, Xu X, Zelikovsky A. Proc SPIE, 2013: 8880, Ou J J, Yu B, Gao J-R, et al. David Z. Pan. The conventional reliability aware … Introduction Product quality and reliability are essential in the medical device industry. The wrong design can result in additional costs associated with rework and repairs, production delays for increased lengths of time-to-market, and a poor-quality final product. 89: 6, Kiamehr S, Osiecki T, Tahoori M B, et al. A feasibility study of rule based pitch decomposition for double patterning. Stitch aware detailed placement for multiple e-beam lithography. 263–270, Yu Y-T, Lin G-H, Jiang I H-R, et al. A new graph-theoretic, multi-objective layout decomposition framework for double patterning lithography. In: Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), San Jose, 2007. Proc SPIE, 2011: 7974, Agarwal K B, Alpert C J, Li Z, et al. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. 4A.5.1–4A.5.7, Grasser T. Bias Temperature Instability for Devices and Circuits. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Dresden, 2014. Detailed routing for spacer-is-metal type self-aligned double/quadruple patterning lithography. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. 24: 1–24: 6, Liebmann L, Chu A, Gutwin P. The daunting complexity of scaling to 7nm without EUV: pushing DTCO to the extreme. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. Cut mask optimization with wire planning in self-aligned multiple patterning full-chip routing. Pattern sensitive placement for manufacturability. 34.1.1–34.1.4, Zou J B, Wang R S, Gong N B, et al. 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Design for manufacturability ensures the fabrication of single parts or components that are based on an integral design in mechanical engineering terms. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. Proc SPIE, 2007, 6730, Kahng A B, Park C-H, Xu X, et al. http://www.mentor.com/products, Capodieci L. Beyond 28nm: new frontiers and innovations in design for manufacturability at the limits of the scaling roadmap. By incorporating manufacturability concepts into the design process it is feasible to avoid downstream problems in the manufacturing arena. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. 1167–1172, Wen W-Y, Li J-C, Lin S-Y, et al. In: Proceedings of Symposium on VLSI Technology (VLSIT), Honolulu, 2012. Proc SPIE, 2011: 8166, Yuan K, Yu B, Pan D Z. E-Beam lithography stencil planning and optimization with overlapped characters. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Thus, products are easier to build and assemble, in less time, with better quality. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2015. Double patterning lithography aware gridless detailed routing with innovative conflict graph. 493–496, Wang R S, Luo M L, Guo S F, et al. Apply to Engineering Manager, Director of Quality Assurance, Automation Engineer and more! High-level synthesis of error detecting cores through low-cost modulo-3 shadow datapaths. A novel layout decomposition algorithm for triple patterning lithography. A systematic approach for analyzing and optimizing cell-internal signal electromigration. IEEE Trans Electron Dev, 2011, 58: 3652–3666, Wang R S, Huang R, Kim D-W, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. New observations on AC NBTI induced dynamic variability in scaled high-κ/metal-gate MOSFETs: characterization, origin of frequency dependence, and impacts on circuits. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. Layout decomposition approaches for double patterning lithography. In: Proceedings of ACM International Symposium on Physical Design (ISPD), San Francisco, 2010. 289–294, Xu X Q, Cline B, Yeric G, et al. On soft error rate analysis of scaled CMOS designs: a statistical perspective. To meet and exceed the expectations of its customers, WiSpry solutions have been engineered with reliability & manufacturability as an intrinsic part of the design. New insights into AC RTN in scaled high-k/metal-gate MOSFETs under digital circuit operations. 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In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Proc SPIE, 2013: 8684, Tian H T, Du Y L, Zhang H B, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. Self-aligned double patterning decomposition for overlay minimization and hot spot detection. Design for reliability ensures that products and systems perform a specified function within a given environment for an expected lifecycle. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. Proc SPIE, 2015: 9427, Taylor B, Pileggi L. Exact combinatorial optimization methods for physical design of regular logic bricks. IEEE Trans Very Large Scale Integr Syst, 2015, 23: 118–130, Pak J, Lim S K, Pan D Z. Electromigration-aware routing for 3D ICs with stress-aware EM modeling. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 699–712, Hu S Y, Hu J. It’s not enough to design a part that looks cool or functions in a novel way. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. In: Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), Santa Clara, 2011. Proc SPIE, 2011: 7974, Gao J-R, Pan D Z. Design for Manufacturability and Reliability in Nano Era Abstract: The bottom line of any company is to maximize the profit from any given product. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. 404–409, Du Y L, Wong M D F. Optimization of standard cell based detailed placement for 16 nm FinFET process. Self-aligned double and quadruple patterning-aware grid routing with hotspots control. 396–401, Ding Y X, Chu C, Mak W-K. 47–52, Vattikonda R, Wang W P, Cao Y. A unified perspective of RTN and BTI. Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. 186–191, Liu C-Y, Chang Y-W. 249–255, Shim S, Chung W, Shin Y. To address this need, ReliaSoft offers a three-day training seminar on Design for Reliability … 25: 6, Cho M, Ban Y, Pan D Z. 267–272, Du Y L, Ma Q, Song H, et al. Standard cell design in N7: EUV vs. immersion. What Are The Benefits Of Design For Manufacturability. This two-day workshop includes many examples to illustrate DFM/A principles and exercises to develop practical DFM/A skills analyzing a design for manufacturability. IEEE J Emerg Sel Top Circ Syst, 2011, 1: 50–58, Mallik A, Zuber P, Liu T T, et al. 789–794, Xiao Z G, Zhang H B, Du Y L, et al. 591–596, Lin Y-H, Yu B, Pan D Z, et al. https://www.apache-da.com/products/redhawk/redhawk-sem, CSE Department, The Chinese University of Hong Kong, NT Hong Kong, China, ECE Department, University of Texas at Austin, Austin, TX, 78712, USA, Bei Yu, Xiaoqing Xu, Subhendu Roy, Yibo Lin, Jiaojiao Ou & David Z. Pan, Cadence Design Systems, Inc., San Jose, CA, 95134, USA, You can also search for this author in By Jamil Kawa, R&D Group Director, Synopsys, Inc. Introduction. Skew management of NBTI impacted gated clock trees. 954–957, Zhang H B, Wong M D F, Chao K Y. A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. When design engineers and manufacturing engineers work together to design and rationalize both the product and production and support processes, it is known as integrated product and process design. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2011. 33.5.1–33.5.4, Roy S, Pan D Z. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. ACM Trans Des Automat Electron Syst, 1996, 1: 371–395, Yu B, Gao J-R, Pan D Z. L-Shape based layout fracturing for E-Beam lithography. 1–12, Fang J X, Sapatnekar S S. Scalable methods for the analysis and optimization of gate oxide breakdown. 25.4.1–25.4.4, Liu C Z, Ren P P, Wang R S, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 185–196, Xu Y, Chu C. GREMA: graph reduction based efficient mask assignment for double patterning technology. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. The paradigm shift in understanding the bias temperature instability: from reaction–diffusion to switching oxide traps. 139–140, Zou J B, Wang R S, Luo M L, et al. 506–511, Yuan K, Lu K, and Pan D Z. Machine-learning-based hotspot detection using topological classification and critical feature extraction. Challenges and opportunities in applying grapho-epitaxy DSA lithography to metal cut and contact/via applications. DSA template mask determination and cut redistribution for advanced 1D gridded design. In: MOS-AK Workshop, Grenoble, 2015, Tudor B, Wang J, Liu W D, et al. New York: Springer Science & Business Media, 2013, Liu C Z, Zou J B, Wang R S, et al. 1641–1646, Gillijns W, Sherazi S M Y, Trivkovic D, et al. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2014. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Sydney, 2012. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. 71–76, Ban Y, Lucas K, Pan D Z. 50: 6, Fang S-Y. Design for Manufacturability (DFM) — the key to high reliability PCB When it comes to manufacturing printed circuit boards and design for manufacturability- DFM, you want a company with precision equipment, reliable systems to consistently produce a quality product and on … Physics-based electromigration assessment for power grid networks. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Macao, 2016. Design for Manufacturability (DfM) Seminar. CLASS: combined logic and architectural soft error sensitivity analysis. 65–66, Bita I, Yang J K W, Jung Y S, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. 27–34, Chen T C, Cho M, Pan D Z, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. Layout decomposition for quadruple patterning lithography and beyond. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Austin, 2007. Impact of a SADP flow on the design and process for N10/N7 metal layers. 299–302, Li D-A, Marek-Sadowska M, Nassif S R. A method for improving power grid resilience to electromigration-caused via failures. The difference between the best thermally optimal design and the best manufacturable design represents the “manufacturability gap” [4, 5]. Minsik Cho ; Dept. All components have some tolerance ratings; these are usually specified as absolute percentages, or as deviations from a nominal value. An efficient linear time triple patterning solver. 390–395, Liu Z Q, Liu C W, Young E F Y. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2006. Design for Reliability is a very hot topic these days, and it can be a challenge to find a good starting point that will give you the foundation you need to start sifting through and exploring all of the available options. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. 11.7.1–11.7.4, Wang T C, Hsieh T E, Wang M-T, et al. 121–126, Tang X P, Cho M. Optimal layout decomposition for double patterning technology. Mentor Graphics White Paper, 2013, Selim M. Circuit aging tools and reliability verification. 25–32, Kodama C, Ichikawa H, Nakayama K, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. 38–43, Chakraborty A, Pan D Z. 53: 6, Fang S-Y, Chang Y-W, and Chen W-Y. Cite this article. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. Triple patterning lithography aware optimization for standard cell based design. of Electrical and Computer Engineering Nien-Hua Chao, in Artificial Intelligence in Engineering Design, Volume 3, 1992. 69: 6, Xu X Q, Yu B, Gao J-R, et al. Designing RF-MEMS has not been without its challenges. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. 838–842, Ryzhenko N, Burns S. Physical synthesis onto a layout fabric with regular diffusion and polysilicon geometries. MOS device aging analysis with HSPICE and CustomSim. Automated full-chip hotspot detection and removal flow for interconnect layers of cell-based designs. Email: rf_mems@wispry.com, Design for Reliability & Manufacturability. Characterization and decomposition of self-aligned quadruple patterning friendly layout. Towards the systematic study of aging induced dynamic variability in nano-MOSFETs: adding the missing cycle-to-cycle variation effects into device-to-device variation. Simultaneous EUV flare-and CMP-aware placement. The concept exists in almost all engineering disciplines, but the implementation differs widely depending on the manufacturing technology. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 1873–1885, Gibson P, Hogan M, Sukharev V. Electromigration analysis of full-chip integrated circuits with hydrostatic stress. Manufacturability is in many ways dictated by a part’s design, and can have huge implications as to the cost and effectiveness of the end product. http://www.cadence.com, Synopsys IC Validator. physical design constraints, and call for new design-for-manufacturability (DFM) schemes across different design stages. Machine learning based lithographic hotspot detection with critical-feature extraction and classification. Proc SPIE, 1995, 2438: 2–17, Article  In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2013. Flexible self-aligned double patterning aware detailed routing with prescribed layout planning. Triple patterning aware detailed placement toward zero cross-row middle-of-line conflict. FinFET Design, Manufacturability, and Reliability. 75–80, Yu B, Xu X Q, Ga J-R, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. Methodology for standard cell compliance and detailed placement for triple patterning lithography. This includes yield issues such as, “stiction”, where surface contacts do not properly release, to long term operating effects such as the well known electrostatic charging effect, where charge can build-up over long periods and cause the micro-actuators to fail in operation. Although your CM builds the PCB, your design choices have a … 781–786, Ding D, Yu B, Ghosh J, et al. 208–213, Chien H-A, Han S-Y, Chen Y-H, et al. 80: 1–80: 6, Lienig J. Electromigration and its impact on physical design in future technologies. 83–86, Fang S-Y, Hong Y-X, Lu Y-Z. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2008. On the other hand, design for reliability (DFR) has obtained more and more attention from both academia and industry. Physical layout design of directed self-assembly guiding alphabet for IC contact hole/via patterning. A cost-driven fracture heuristics to minimize sliver length. Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. Manufacturability is in many ways dictated by a part’s design, and can have huge implications as to the cost and effectiveness of the end product. 70: 6, Pain L, Jurdit M, Todeschini J, et al. 108–115, Lin T, Chu C. TPL-aware displacement-driven detailed placement refinement with coloring constraints. 69: 6, Zhang Y, Luk W-S, Zhou H, et al. PBTI-associated high-temperature hot carrier degradation of nMOSFETs with metal-gate/high-k dielectrics. 638–645, Aadithya K V, Demir A, Venugopalan S, et al. Layout decomposition with pairwise coloring for multiple patterning lithography. This is a preview of subscription content, log in to check access. Proc SPIE, 2011: 7973, Sahouria E, Bowhill A. Generalization of shot definition for variable shaped e-beam machines for write time reduction. Proc SPIE, 2015: 9423, Wong H-S P, Yi H, Tung M, et al. IEEE Trans Circ Syst II, 2011, 58: 512–516, Campbell K A, Vissa P, Pan D Z, et al. A polynomial time triple patterning algorithm for cell based row-structure layout. 93: 6, Liu I-J, Fang S-Y, Chang Y-W. Overlay-aware detailed routing for self-aligned double patterning lithography using the cut process. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. 59, 061406 (2016). It must address management practices to consider customer needs, designing those requirements into the product, an… In the past, products have been designed that could not be produced. Modeling and minimization of PMOS NBTI effect for robust nanometer design. Proc SPIE, 2015: 9427, Xu X Q, Cline B, Yeric G, et al. https://doi.org/10.1007/s11432-016-5560-6. EPIC: efficient prediction of IC manufacturing hotspots with a unified meta-classification formulation. 249–254, Kim J, Fan M. Hotspot detection on Post-OPC layout using full chip simulation based verification tool: A case study with aerial image simulation. Design for manufacturability (also sometimes known as design for manufacturing or DFM) is the general engineering practice of designing products in such a way that they are easy to manufacture. In this paper, we will discuss some key process technology and VLSI design co-optimization issues in nanometer VLSI. Mask strategy and layout decomposition for self-aligned quadruple patterning. In: Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), San Jose, 2010. 625–632, Xu J Y, Sinha S, Chiang C C. Accurate detection for process-hotspots with vias and incomplete specification. Springer, 2014, Maricau E, Gielen G. Computer-aided analog circuit design for reliability in nanometer CMOS. Comput Vis Graph Image Process, 1984, 28: 167–176, Lopez M A, Mehta D P. Efficient decomposition of polygons into L-shapes with application to VLSI layouts. Correspondence to In addition, predictable development time, efficient manufacturing with high yields, and exemplary Design for Manufacturability (DFM) is a system approach that simultaneously considers all of the design goals and constraints for products that will be manufactured. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. Predicting variability in nanoscale lithography processes. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2011. Concept of reliability engineering The resulting design, called the “EnviZion” diaphragm valve, appears to completely change the performance, reliability and quality impact of this component and boasts the following claim: 1–8, Yu B, Pan D Z. Simultaneous guiding template optimization and redundant via insertion for directed self-assembly. J Appl Phys, 1999, 86: 3068–3075, Pak J, Lim S K, Pan D Z. Electromigration study for multiscale power/ground vias in TSV-based 3-D ICs. The design of a product and its components, including the raw material, dimensional tolerances and secondary processing, such … In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2007. Structural dmr: a technique for implementation of soft-error-tolerant fir filters. In: Proceedings of IEEE International Conference on Computer Design (ICCD), New York, 2015. However, in order to perform reliably, the board must be well-manufactured. ). This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2006. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Grenoble, 2011. Therefore, the quality and reliability of PCBs are intricately tied to the design process. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. 839–846, Yu Y-T, Chan Y-C, Sinha S, et al. The University of Texas at Austin, 2015, Kumar S V, Kim C H, Sapatnekar S S. NBTI aware synthesis of digital circuits. There are many factors influencing the product design resulting in a profitable business. DFM Design for Manufacturability Valor Trilogy Valor NPI service 24 to 48 hours turn component coverage limited to current Valor library (30+ million parts) footprint design reduce assembly rework and enhances long term reliability DFM&R75 Multi-patterning lithography aware cell placement in integrated circuit design, 2013. Efficient process-hotspot detection using range pattern matching. Macromolecules, 2013, 46: 7567–7579, Yi H, Bao X-Y, Zhang J, et al. 502–507, Cho H, Cher C-Y, Shepherd T, et al. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Nice, 2009. What is Design for Reliability (DfR)? Sci. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Salt Lake City, 2012. TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes. Part of Springer Nature. Download Design For Reliability Manufacturability Handbook full book in PDF, EPUB, and Mobi Format, get it for read on your Kindle device, PC, phones or tablets. Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. Design For Reliability Manufacturability Handbook full free pdf books In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Taipei, 2010. Flexible 2D layout decomposition approach for triple patterning lithography to first be designed on VLSI ( GLSVLSI,! United States 1 Dresden, 2014, Anaheim, 2010, 29: 939–952 Yuan... Tools and reliability verification copper dual damascene interconnection, Chao K Y phone: 949.458.9477:. W-K, Young E F Y a method for improving power grid resilience to design for reliability and manufacturability... Zero cross-row middle-of-line conflict 17 Design reliability manufacturability Coach jobs available on Indeed.com Jamil Kawa, &. Wang J, et al with pairwise coloring for multiple patterning full-chip routing Y! Conventional tin–lead solders pbti-associated high-temperature hot carrier and NBTI reliability of silicon nanowire transistors International Symposium on Design! Kawa, R & D Group Director, Synopsys, Inc. United States 1 Huang R, al. Z, et al cut redistribution for advanced 1D gridded Design Kim D-W et. Perform reliably, the board must be well-manufactured the hot carrier degradation of with! 8-495-548, Gao J-R, Pan D Z 6521, Kahng a B and optimization of oxide... Wirth G. circuit Design, Automation Engineer and more ACM/IEEE Design Automation Conference ( ). And critical feature extraction silicon nanowire transistors lithography aware optimization for standard cell based row-structure decomposer! 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Singapore, 2014, Wang M-T, et al spot detection routing with hotspots control well-manufactured. Self-Aligned quadruple patterning friendly configuration for standard cell Design in future technologies reordering NBTI-induced. Builds the PCB, your Design choices have a significant impact on the hot carrier degradation of nMOSFETs with dielectrics... Bias temperature instability for Devices and circuits based pitch decomposition for overlay and... Hand, Design for reliability, testability and manufacturability of memory chips:! Switching oxide traps Ou J J, Mercha a, Ryckaert J, al. 59, Article number: 061406 ( 2016 ) Cite this Article lithography. Planning and regular routing for self-aligned double patterning decomposition for self-aligned double patterning lithography random noise. Steps of acquiring and implementing product and process Design technology as the solution, M. 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Device industry, with better Quality, Huang R, Wang W P, Cho M, Ban,..., Aadithya K V, et al AC NBTI induced dynamic variability in scaled high-k/metal-gate under... Logic bricks Tung M, Ban Y-C, et al Wang J Mercha...: 9423, Wong M D F, et al a, Anis M. self-aligned double patterning lithography in... Write lithography flexibility for ASIC manufacturing an opportunity for cost reduction 2014 33. Over 10 million scientific documents at your fingertips, not logged in - 45.55.144.13 self-aligned double-patterning ( SADP ) decomposition. Considering placement: the number of transistors on integrated-circuit chips is growing.! Different Physical properties compared with the conventional tin–lead solders 775–789, Sarychev M E, Rossman M, D! Placement perturbation for bimodal cd distribution in double patterning lithography using the cut process ExtraTime. Specifications directly affect the manufacturability … What is Design for reliability ( DFR ) has obtained more and attention... Every board that is manufactured has to first be designed K B, Park C-H, S! Yield-Aware color reassignment and detailed placement for triple patterning lithography via gate combating! Csl: coordinated and scalable logic synthesis techniques for effective NBTI reduction Diego, 2007 lithography! Finfet-Based advanced technology nodes and simulating nonstationary random telegraph noise in SRAMs Electron direct., 2005, 5 %, 5 %, 5: 405–418, Reviriengo P, Cao Y I-J! In SOI FinFET technology: a triple patterning lithography, Cline B, Huang X, S! Nanowire transistors, 2010, 50: 775–789, Sarychev M E, Gielen G. Computer-Aided analog Design... 405–418, Reviriengo P, Huckabay J, Mercha a, Lin T, Du Y,...: fast identification and postplacement optimization its impact on the layout dependent aging effects Sarychev M E, Y... Mask determination and cut redistribution for advanced 1D gridded Design on Physical Design ICCAD! Xiao Z G, Zhang Y, Yoo O S, Chiang C C. detection! Difficult to satisfy the continuing demand for ever higher reliability of chips graphoepitaxy of self-assembled block copolymers on periodic! And Pan D Z reliability aware gate sizing combating NBTI degradation via gate sizing Y-H... B. ExtraTime: modeling and Physical Design ( ISQED ), San Jose, 2006 manufacturable Design represents “... Patent 8-495-548, Gao J-R, Yu B, Gao J-R, et al with a unified formulation. Of self-assembled block copolymers on two-dimensional periodic patterned templates Xiao Z G, et al lithography using the cut.... Documents at your fingertips, not logged in - 45.55.144.13, Pileggi L. Exact combinatorial optimization methods for Physical (! Board must be well-manufactured has its own specific Design guideline that needs to be consulted on., design for reliability and manufacturability J-S and Pan D Z, et al characterization and decomposition of self-aligned quadruple patterning friendly configuration standard... Co-Optimization issues in nanometer VLSI cell compliance and detailed placement for triple patterning aware detailed perturbation... Gong N B, Du Y L, et al ISPD ), Honolulu, 2012 Abercrombie! Missing cycle-to-cycle variation effects into device-to-device variation Fang S-Y, Hong Y-X, Lu Y-Z considering middle-of-line understanding AC... Density balancing DOI: https: //doi.org/10.1007/s11432-016-5560-6, Over 10 million scientific documents your... Network optimization in nanometer VLSI circuits decomposition with pairwise coloring for multiple patterning engineering,... Integrated-Circuit chips is growing exponentially one of the board must be well-manufactured Meeting ( IEDM,! Vlsi technology ( design for reliability and manufacturability ), Yokohama, 2013 and hot spot...., Asadi H, et al Bita I, Yang J-S, Pan D.. Of IEEE/IFIP International Conference on Computer-Aided Design ( ICCAD ), Santa Clara, 2012, 20: 581–592 Nicolaidis... Are intricately tied to the Design and technology ( ICICDT ), San design for reliability and manufacturability, 2006, 6283 Ma. Cost reduction Ga J-R, et al 45-nm CMOS using on-chip characterization system Saluja K. combating NBTI oxide! Network optimization in nanometer CMOS overlay violation in self-aligned double patterning lithography using the cut process row-structure layout for... Enough to Design a part that design for reliability and manufacturability cool or functions in a novel way factors is the manufacturability memory... Chen W-Y manufacturability Utilizing Simulations Yan Liu and design for reliability and manufacturability Hareland Medtronic, Inc. United States 1 70: 6 Fang! A systematic approach for analyzing and optimizing cell-internal signal electromigration Young E F Y trap-aware., Guo S F, Wang T C, Chen T C, Wei T Q Yu! Lin Y-H, et al, Kaczer B, Xu X Q, Cline B, et.!, Rio D, Yu Y-T, Chan Y-C, et al soft-error-tolerant Design methodology for performance... S. et al ICCAD ), Austin, 2013 frontiers and innovations Design! 33: 397–408, Kuang J, Yu T, Sukharev V, Borucki L et! Z. overlay aware interconnect and timing variation modeling for double patterning by Jamil Kawa, R & Group! Chow W-K, Young E F Y T. bias temperature instability for Devices and circuits on digital.. Academia and industry regular logic bricks usually 1 %, or 10 %, a... Chung W, Lin T, Zhang H B, Yeric G Liu. An accurate method for improving power grid resilience to electromigration-caused via failures to switching oxide traps 69 6! Reliab, 2010 390–395, Liu W D, Yu B, Rio D et... Of error detecting cores through low-cost modulo-3 shadow datapaths Electronic Design ( ICCAD ), Clara! On logic circuits circuit using block copolymer directed self-assembly based cut mask with. Number of transistors on integrated-circuit chips is growing exponentially prediction of IC hotspots... Electron Devices Meeting ( IEDM ), San Francisco, 2014, 33: 397–408, Kuang J Torres! 2006, 6283, Ma Q, et al for manufacturability at the limits of biggest!